Paras Semiconductors ties up with US firm BroadPak to bring 2.5D, 3D and chiplet packaging to India
Paras Defence's chip arm has partnered San Jose-based BroadPak to set up a heterogeneous integration and 3D packaging OSAT facility in India, with technology transfer in 2.5D/3D, chiplet integration and hybrid bonding for AI and HPC applications.
India's chip story has so far been told mostly through big-ticket assembly plants and plans for front-end fabrication. The next frontier is subtler and arguably more important for the AI era: advanced packaging, the set of techniques that stacks and stitches multiple pieces of silicon into one high-performance module. On 6 November 2026, Navi Mumbai-based Paras Defence and Space Technologies said its subsidiary, Paras Semiconductors, has signed a strategic technology partnership with San Jose-based BroadPak Corporation to build exactly that capability in India.
What has been announced
According to the PTI report carried by The Week and subsequent trade coverage, the core objective of the partnership is to set up a heterogeneous integration and 3D packaging OSAT (outsourced semiconductor assembly and test) facility on Indian soil.
Under the arrangement, Paras Semiconductors will gain access to BroadPak's design, manufacturing and integration intellectual property, along with technology transfer and process know-how in 2.5D/3D packaging and chiplet integration. The two companies also plan to explore:
- joint development of advanced packaging platforms for AI and high-performance computing applications; and
- collaborative training and skill development for Indian engineers.
The planned unit is described as offering chiplet integration, 2.5D/3D packaging, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and advanced semiconductor testing and qualification. Paras Semiconductors' chief executive Santosh Kumar was quoted as saying the collaboration aims to build capabilities in 2.5D/3D heterogeneous integration, chiplet architectures, hybrid bonding and advanced system-in-package technologies.
No capex figure, site or timeline was disclosed with the BroadPak announcement.
Who BroadPak is
BroadPak is a US company focused on 2.5D/3D integration and semiconductor packaging. Its work spans 2.5D/3D IC packaging, heterogeneous integration, multi-die architectures, high-speed interconnects, thermal management and co-packaged optics — the engineering disciplines that determine whether a stack of chiplets actually performs, stays cool and survives qualification. In the division of labour described in coverage, BroadPak brings architecture and design frameworks, while Paras handles local integration, infrastructure and execution.
Why packaging, and why now
For decades, performance gains came mainly from shrinking transistors. That is getting slower and far more expensive. The industry's answer has been to break big chips into smaller "chiplets" and reassemble them — side by side on a silicon interposer (2.5D) or stacked vertically (3D) — so that logic, memory and I/O can each be made on the most suitable process. The AI accelerators that power today's data centres depend heavily on this kind of packaging, and capacity for it has become one of the tightest bottlenecks in the global supply chain.
Some of the technologies on Paras's list are at the very leading edge:
- Hybrid bonding joins dies with direct copper-to-copper connections at extremely fine pitch, enabling much denser vertical interconnects than conventional micro-bumps.
- Fan-out packaging (wafer- or panel-level) redistributes connections beyond the die footprint without a traditional substrate, useful for compact, high-I/O devices.
- Co-packaged optics places optical engines right next to switch or compute silicon, cutting the power cost of moving data — a growing concern in AI clusters.
Most of India's approved OSAT and ATMP projects so far are focused on more conventional assembly and test. A partner that brings 2.5D/3D and chiplet know-how could help an Indian player move up that value chain rather than compete only on mature packages.
How it fits Paras's earlier plans
The BroadPak deal follows Paras Semiconductors' July 2026 memorandum of understanding with the Madhya Pradesh State Electronics Development Corporation for a greenfield advanced IC packaging OSAT facility in the Indore-Ujjain region, with a proposed investment of about ₹6,200 crore (reported by Evertiq as roughly $644 million). The company has not said whether the BroadPak technology will be deployed at that site, so the two announcements should be read as related but separate for now.
For Paras, a listed defence electronics and optics supplier, semiconductors are a logical adjacency: defence, space and secure communications all need trusted, domestically controlled chip supply, and advanced packaging is increasingly where system-level performance and security are decided.
The policy backdrop
The timing lines up with a broader push. The government approved the ₹1.275 trillion second phase of its semiconductor programme (Semicon 2.0), and officials have said that five of the 12 approved semiconductor projects are now in commercial production. Policy makers have repeatedly identified advanced packaging and design as areas where India can build differentiated capability faster than in leading-edge front-end fabrication.
What to watch
The partnership is still at an early, intent-stage. The key milestones that will show whether it becomes real capacity are:
- a confirmed site, investment figure and timeline for the 2.5D/3D line;
- whether the project seeks support under Semicon 2.0 or state incentives;
- the scope of the technology transfer and how many Indian engineers are trained; and
- first qualified products and anchor customers — especially in AI/HPC, defence and space.
If those boxes are ticked, India would gain a foothold in one of the most strategically valuable — and least crowded — parts of the semiconductor supply chain.
Sources
- https://www.theweek.in/wire-updates/business/2026/11/06/paras-semiconductors-broadpak-join-hands-to-build-advanced-semiconductor-packaging-capabilities.html
- https://evertiq.com/design/2026-11-10-paras-broadpak-to-develop-advanced-packaging-facility-in-india
- https://timestech.in/paras-semiconductors-partners-with-broadpak-to-boost-packaging-in-india/
- https://www.electronicsforyou.biz/industry-buzz/paras-semiconductors-partners-with-broadpak-for-advanced-packaging-in-india/
- https://evertiq.com/news/2026-07-22-paras-to-set-up-644-million-chip-packaging-facility-in-india
- https://www.angelone.in/news/stocks/paras-defence-and-space-technologies-shares-in-focus-as-its-subsidiary-signs-mou-for-osat-facility-in-madhya-pradesh